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Flip-chip pin grid array

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This is an old revision of this page, as edited by Northamerica1000 (talk | contribs) at 23:06, 30 December 2011 (- {{refimprove|date=December 2011}} after adding more references). The present address (URL) is a permanent link to this revision, which may differ significantly from the current revision.
The underside of a FC-PGA package (the die is on the other side)

Flip-chip pin grid array (FC-PGA or FCPGA) is a form of pin grid array integrated circuit packaging in which the die faces downwards on the top of the substrate with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other cooling mechanism.

The FCPGA was introduced by Intel with the Coppermine core Pentium III and Celeron[1] processors based on Socket 370, and was later used for Socket 478-based Pentium 4[2] and Celeron processors. FC-PGA processors fit into zero insertion force (ZIF) Socket 370 and Socket 478-based motherboard sockets; similar packages have also been used by AMD. It is still used today for mobile Intel processors.

See also

References

  1. ^ "Intel Releases New Design for sub-$1,000 PCs". Philippine Daily Inquirer. April 24, 2000. {{cite web}}: |access-date= requires |url= (help); Italic or bold markup not allowed in: |publisher= (help); Missing or empty |url= (help)
  2. ^ "Intel Mobile Pentium 4 552 / 3.46 GHz processor (mobile) (Manufacturer description)". CNET. December 26, 2004. Retrieved December 30, 2011. {{cite web}}: External link in |publisher= (help)

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